About WaveSplitter Technologies

WaveSplitter was founded in 1996 and is headquartered in Taipei, Taiwan, with laser chip R&D and manufacturing as well as module R&D based in Taoyuan City, and module manufacturing facilities located in New Taipei City, Taiwan. A high capacities laser chips and modules manufacturing in Vietnam; and our sales office are located in Tokyo, Japan.

Our vertically integrated platform — from optical chips to fully integrated modules — supports three major application domains HPC / AI / Data Center, 5G CPRI and FTTx, and Optical Sensing (including OCT, LiDar and Gas Sensing).

Company Profile

WaveSplitter Technologies, Inc. develops, manufactures, and supplies optical components and modules for AI, data center, broadband, and enterprise applications. Our product line up spans laser, detectors, GPON/10G PON/50G PON, Combo PON, BIDI, CWDM/DWDM solutions, and high-speed optical transceivers supporting data rates from 1G to 400G, 800G, and up to 1.6T, across multiple distances and form factors.

The company offers industry-standard transceiver and interconnect solutions, including SFP, QSFP, QSFP-DD, OSFP, and ELSFP, enabling customers to build cost-effective, high-capacity optical infrastructures for AI systems, FTTH/FTTR deployments, data center – CPO solution and 5G networks.

In addition to communications, WaveSplitter’s laser chips and photodetector technologies support OCT, LiDAR and industrial measurement applications, extending the company’s capabilities into advanced sensing markets.

Key Milestone
Up to 2025
Developing 50G PON DFB laser for Telecom solution
Developing 800G OSFP 2xFR4 Si-Photonic Transceiver with owned CW laser (4 wavelengths)
Developing External Laser SFP (ELSFP) for CPO application
800G Si-Photonic OSFP 2xDR4 (LPO version) with owned CW laser
800G Si-Photonic OSFP 2xDR4 (DSP version) with owned CW laser
2024-2022
Developing Si-Photonic Technology for Future Products over 800G.
Developing 100G DR1 and 400G DR4 PAM4 Transceiver for DC Applications.
Developing 1310nm HP CW DFB Laser for DC & CPO Applications.
Developing 25G ER and 100G ER4/ER4/ZR4 TRx Products.
2020
Developed 25G LR/BIDI TO / OSA and 100G CWDM4 products for DC Applications.
2019
Developed low-cost CWDM, CWDM4, and LR Transceivers using internal lasers.
Established Taiwan Factory for Laser and Transceiver production.
2018
Developed 1310nm, 25G C&I-Temp DFB Laser for 25G LR and 100G PSM4 Applications
2017
Developed 1310nm, 10G C-Temp DFB Laser / TO / OSA
2010
Headquarter Moved from California to Taiwan
2003
Started Active Fiber Optics Component, Focus on LD, Modules
1996
Passive Fiber Optics Components, Focus on WDM / DWDM WavePump and AWG
Company Founded and Established in San Jose, CA
Global Locations
Tokyo, Japan
Taipei, Taiwan
Vietnam

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